型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
---|---|---|---|---|---|---|---|---|
IS42VS32200E-10BLI | ISSI/芯成 | BGA90 | 25+ | 10800 | 2025-08-30 | |||
IS45S16400J-7BLA1 | ISSI/芯成 | BGA54 | 25+ | 8505 | 2025-08-30 | |||
IS45S16320F-7TLA2-TR |
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ISSI/芯成 | TSOP54 | 25+ | 5498 | 2025-08-30 | ||
IS43TR82560DL-125KBLI-TR | ISSI/芯成 | BGA78 | 25+ | 10550 | 2025-08-30 | |||
IS43TR16128D-125KBLI-TR |
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ISSI/芯成 | BGA96 | 25+ | 10800 | 2025-08-30 | ||
IS43LR32320B-6BLI | ISSI/芯成 | BGA90 | 25+ | 4320 | 2025-08-30 | |||
IS43LD32160A-25BLI | ISSI/芯成 | FBGA134 | 25+ | 10800 | 2025-08-30 | |||
IS43LD32128A-25BPLI-TR | ISSI/芯成 | VFBGA168 | 25+ | 16800 | 2025-08-30 |
型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
---|---|---|---|---|---|---|---|---|
S29GL256S90TFI010 |
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SPANSION/飞索半导体 | TSOP56 | 25+ | 14500 | 2025-08-30 | ||
S29GL256P10TFI010 |
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SPANSION/飞索半导体 | TSOP56 | 25+ | 14500 | 2025-08-30 | ||
S29GL128P90TFCR10 | SPANSION/飞索半导体 | TSOP56 | 25+ | 86 | 2025-08-30 | |||
S29GL128P10TFI020 | SPANSION/飞索半导体 | TSOP56 | 25+ | 112 | 2025-08-30 | |||
S29GL032N90BFI040 |
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SPANSION/飞索半导体 | FBGA48 | 25+ | 14500 | 2025-08-30 | ||
S25FL256SAGMFIG01 |
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SPANSION/飞索半导体 | SOP16 | 25+ | 14500 | 2025-08-30 | ||
S25FL256SAGMFIG00 |
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SPANSION/飞索半导体 | SOP16 | 25+ | 14500 | 2025-08-30 | ||
S25FL256SAGMFI003 |
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SPANSION/飞索半导体 | SOP16 | 25+ | 14500 | 2025-08-30 |
型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
---|---|---|---|---|---|---|---|---|
S25FL256SAGNFI010 |
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SPANSION/飞索半导体 | WSON8 | 25+ | 14100 | 2025-08-30 | ||
S25FL256SAGNFI013 |
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SPANSION/飞索半导体 | WSON8 | 25+ | 14100 | 2025-08-30 | ||
S25FL256SAGNFI011 |
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SPANSION/飞索半导体 | WSON8 | 25+ | 14100 | 2025-08-30 | ||
S34ML08G101BHI000 |
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SPANSION/飞索半导体 | BGA63 | 25+ | 4500 | 2025-08-30 | ||
S29JL064J70TFI000 |
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SPANSION/飞索半导体 | TSOP48 | 25+ | 14500 | 2025-08-30 | ||
SN7326A424E | SI-EN/矽恩 | WQFN-24 | 25+ | 250000 | 2025-08-30 | |||
TIP41CG | ONSEMI/安森美 | TO-220 | 25+ | 25000 | 2025-08-30 | |||
W25Q40CLUXIG |
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WINBOND/华邦 | USON8 | 25+ | 5000 | 2025-08-30 |
型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
---|---|---|---|---|---|---|---|---|
S25FL132K0XBHIS20 |
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SPANSION/飞索半导体 | BGA | 25+ | 200 | 2025-08-30 | ||
S25FL127SABMFI000 | SPANSION/飞索半导体 | SOP16 | 25+ | 1000 | 2025-08-30 | |||
S25FL116K0XNFI013 |
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SPANSION/飞索半导体 | WSON8 | 25+ | 11400 | 2025-08-30 | ||
S25FL116K0XNFI010 |
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SPANSION/飞索半导体 | WSON8 | 25+ | 11400 | 2025-08-30 | ||
S25FL064P0XBHI020 |
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SPANSION/飞索半导体 | BGA | 25+ | 200 | 2025-08-30 | ||
S25FL032P0XMFI010 |
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SPANSION/飞索半导体 | SOIC8 | 25+ | 22750 | 2025-08-30 | ||
S25FL032P0XBHIS30 |
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SPANSION/飞索半导体 | BGA24 | 25+ | 7550 | 2025-08-30 | ||
IS66WVH8M8ALL-166BLI-TR- |
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ISSI/芯成 | TFBGA25 | 25+ | 10800 | 2025-08-30 |
型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
---|---|---|---|---|---|---|---|---|
IS61QDPB41M18C-250B4L | ISSI/芯成 | BGA165 | 25+ | 10800 | 2025-08-30 | |||
IS61QDPB41M18A-400M3LI | ISSI/芯成 | BGA165 | 25+ | 10800 | 2025-08-30 | |||
IS61QDPB41M18A-400B4L | ISSI/芯成 | BGA165 | 25+ | 10800 | 2025-08-30 | |||
IS61QDPB41M18A-300M3L | ISSI/芯成 | BGA165 | 25+ | 10800 | 2025-08-30 | |||
IS61QDPB41M18A-300B4L | ISSI/芯成 | BGA165 | 25+ | 10800 | 2025-08-30 | |||
IS61QDPB41M18A-250M3L | ISSI/芯成 | BGA165 | 25+ | 10800 | 2025-08-30 | |||
IS61QDPB41M18A-250B4L | ISSI/芯成 | BGA165 | 25+ | 10800 | 2025-08-30 | |||
IS61QDPB251236A-333M3L | ISSI/芯成 | BGA165 | 25+ | 10800 | 2025-08-30 |